By clicking Sign In, I will check the data entered to pass our security cretentials. Equipped with integrated dispenser, 12 wafer handling, automatic tool changer, and application specific tooling, the 2200 evo is prepared for present and future processes and products. The Datacon 2200 evo plus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform, enhanced with key features for higher. ![]() ![]() Warning: Missing argument 4 for avia_woocommerce_gallery_thumbnail_description() in /home/csisemi/public_html/wp-content/themes/enfold/config-woocommerce/config. DATACON 2200 evo The 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. CAUTION For all maintenance work described below, the machine must be completely disconnected from all services (electrical power, compressed air, vacuum and. Warning: Missing argument 4 for avia_woocommerce_gallery_thumbnail_description() in /home/csisemi/public_html/wp-content/themes/enfold/config-woocommerce/config.php on line 1251 material, support and automation for electronic manufacturers in the Nordic and Baltic countries and Poland. Warning: Missing argument 3 for avia_woocommerce_gallery_thumbnail_description() in /home/csisemi/public_html/wp-content/themes/enfold/config-woocommerce/config.php on line 1251 The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Besi Datacon 2200 Evo Plus R2R Pick and Place/Bonding Tool for Hybrid Integration Modifed version of standard EVO 2200-Plus X/Y placement accuracy: 7 m.
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